Method for off-grid routing structures utilizing self aligned double patterning  (sadp) technology

ABSTRACT

A method for efficient off-track routing and the resulting device are disclosed. Embodiments include: providing a hardmask on a substrate; providing a plurality of first mandrels on the hardmask; providing a first spacer on each side of each of the first mandrels; providing a plurality of first non-mandrel regions of the substrate being separated from the first mandrels and between two of the first spacers, each of the first mandrels, first non-mandrel regions, and first spacers having a width equal to a distance; and providing a second mandrel having a width of at least twice the distance and being separated from one of the first non-mandrel regions by a second spacer.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Divisional of U.S. application Ser. No.13/766,141, filed Feb. 13, 2013 the content of which is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a fabrication of metal structures. Thepresent disclosure is particularly applicable to fabrication of off-gridmetal structures in integrated circuits (ICs) utilizing SADP technology.

BACKGROUND

In a fabrication of metal routes, particularly a fabrication of metalroutes using SADP technology, metal routes are typically placed on oneof many pre-determined gridded routing tracks. Such routing tracks arefrequently spaced to efficiently utilize space on an IC layout and toobtain adequate performance, reliability, and manufacturability of theresulting device. However, off-grid routing may become necessary toallow flexible pin access, redundant via/via bar insertion, and metaltransition. Unfortunately, traditional methods place off-grid metalislands between routing tracks, resulting in inefficient use of IClayouts utilizing SADP technology. For instance, some methods requirefour tracks for insertion of a single off-grid metal island betweenrouting tracks.

A need therefore exists for methodology enabling efficient off-trackrouting for ICs utilizing SADP technology, and the resulting device.

SUMMARY

An aspect of the present disclosure is a method of fabricating asemiconductor device having an off-grid metal structure preventing useof two tracks by, inter alia, providing a mandrel having a width of atleast a distance between pre-determined gridded routing tracks.

An aspect of the present disclosure is a method of fabricating asemiconductor device having an off-grid metal structure preventing useof three tracks by, inter alia, providing a non-mandrel region having awidth of at least a distance between pre-determined gridded routingtracks.

A further aspect of the present disclosure is a device having, interalia, a metal route positioned on one vertical position of equallyspaced vertical positions (e.g., pre-determined gridded routing tracks)and extending vertically onto at least a midpoint between the onevertical position and another one of the vertical positions (e.g., anadjacent track).

Additional aspects and other features of the present disclosure will beset forth in the description which follows and in part will be apparentto those having ordinary skill in the art upon examination of thefollowing or may be learned from the practice of the present disclosure.The advantages of the present disclosure may be realized and obtained asparticularly pointed out in the appended claims.

According to the present disclosure, some technical effects may beachieved in part by a method including: providing a hardmask on asubstrate; providing a plurality of first mandrels on the hardmask;providing a first spacer on each side of each of the first mandrels;providing a plurality of first non-mandrel regions of the substratebeing separated from the first mandrels and between two of the firstspacers, each of the first mandrels, first non-mandrel regions, andfirst spacers having a width equal to a distance; and providing a secondmandrel having a width of at least twice the distance and beingseparated from one of the first non-mandrel regions by a second spacerand/or providing a second non-mandrel region having a width of at leasttwice the distance and being adjacent to at least one of the firstspacers or a third spacer of a third mandrel and separated from one ormore block masks.

Some aspects include a method, wherein the second mandrel is provided,the method further including: providing a fourth mandrel on thehardmask; and providing one or more spacers between the second andfourth mandrels, the one or more spacers covering an entire uppersurface of the hardmask between the second and fourth mandrels.Additional aspects include providing the fourth mandrel with a width ofat least the distance, and the one or more spacers with a width of twicethe distance. Some aspects include a method wherein, the one or morespacers include a fourth spacer adjacent to the second mandrel and afifth spacer adjacent to the fourth mandrel, each of the fourth andfifth spacers having a width equal to the distance. Further aspectsinclude a method, wherein the second non-mandrel region is provided, themethod further including providing one of the block masks between thesecond non-mandrel region and one of the first or third spacers, theblock mask preventing etching of portions of the hardmask covered by theone block mask. Additional aspects include: providing the third mandrelregion having a width of at least the distance and with the third spacerhaving a width of the distance; and providing the one block mask havinga width of at least three times the distance. Further aspects include:etching the hardmask, each respective spacer of the first spacerspreventing etching of one or more portions covered by the respectivespacer; etching, after etching of the hardmask, the substrate, thehardmask preventing etching of portions covered by the hardmask; andforming a metal layer in recesses formed by the etching of thesubstrate. Some aspects include: removing the first mandrels prior toetching the hardmask, wherein a mandrel metal route is provided in arecess formed by etching a portion of the hardmask formerly covered byone of the first mandrels and a non-metal route is formed in a recessformed by etching the hardmask in one of the first non-mandrel regions.

Another aspect of the present disclosure is a device including: an ICformed on a substrate; a plurality of metal routes extendinghorizontally on the substrate and placed on one of a plurality ofequally spaced vertical positions being separated by a distance; and ametal route of the metal routes positioned on one of the verticalpositions and extending vertically onto at least a midpoint between theone vertical position and another vertical position.

Aspects include a second metal route of the metal routes beingpositioned on a second vertical position of the vertical positionsadjacent to the one vertical position. Some aspects include a thirdmetal route of the metal routes being positioned on a third verticalposition of the vertical positions being within three vertical positionsfrom the one vertical position, the second and third vertical positionsbeing on opposite sides of the one vertical position. Further aspectsinclude the metal routes being formed by either a mandrel metal or anon-mandrel metal of a SADP technology, wherein metal routes formed by amandrel metal are separated from each other by at least one verticalposition and metal routes formed by a non-mandrel metal are separatedfrom each other by at least one vertical position. Additional aspectsinclude the third metal route of the metal routes being positioned on avertical position three vertical positions from the one verticalposition when the one metal route is formed by a non-mandrel metal andpositioned on a vertical position two vertical positions from the onevertical position when the one metal route is formed by a mandrel metal.Further aspects include the metal routes being within a M1 or M2 layerof the IC. Some aspects include the metal route being connected toanother metal layer via a redundant via, a pin access, or a metaltransition region. Additional aspects include a device, wherein thedistance is a multiple of a critical distance associated with one ormore masks fabricating the IC.

Another aspect of the present disclosure is a method including:providing a hardmask on a substrate; providing a plurality of firstmandrels on the hardmask; providing a first spacer on each side of eachof the first mandrels; providing a plurality of first non-mandrelregions of the substrate being separated from the first mandrels andbetween two of the first spacers, each of the first mandrels, firstnon-mandrel regions, and first spacers having a width equal to adistance; providing a second mandrel having a width of at least twicethe distance and having a second spacer adjacent to one of the firstnon-mandrel regions and/or providing a second non-mandrel region havinga width of at least twice the distance and being adjacent to at leastone of the first spacers or a third spacer of a third mandrel andseparated from one or more block masks; removing the first mandrelsafter providing the first spacers; etching the hardmask, each respectivespacer of the first spacers preventing etching of one or more portionscovered by the respective spacer; etching the substrate, after etchingof the hardmask, the hardmask preventing etching of portions covered bythe hardmask; and forming a metal layer in recesses formed by theetching of the substrate.

Aspects include a method, wherein the second mandrel is provided, themethod further including: providing a fourth mandrel having a width ofat least the distance; and providing one or more spacers between thesecond and fourth mandrels, the one or more spacers covering an entireupper surface of the hardmask between the second and third mandrels andhaving a width of twice the distance. Some aspects include a method,wherein the one or more spacers include a fourth spacer adjacent to thesecond mandrel and a fifth spacer adjacent to the fourth mandrel.Further aspects include a method, wherein the second non-mandrel regionis provided, the method further including: providing the third spacerand the third mandrel having widths of at least the distance; andproviding one of the block masks between the second non-mandrel regionand either the one first spacer or the third spacer, the one block maskhaving a width of three times the distance and preventing an etching ofportions of the hardmask covered by the one block mask.

Additional aspects and technical effects of the present disclosure willbecome readily apparent to those skilled in the art from the followingdetailed description wherein embodiments of the present disclosure aredescribed simply by way of illustration of the best mode contemplated tocarry out the present disclosure. As will be realized, the presentdisclosure is capable of other and different embodiments, and itsseveral details are capable of modifications in various obviousrespects, all without departing from the present disclosure.Accordingly, the drawings and description are to be regarded asillustrative in nature, and not as restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawing and in whichlike reference numerals refer to similar elements and in which:

FIGS. 1A through 1D schematically illustrate sequential steps of formingmetal routes on pre-determined gridded routing tracks;

FIG. 1E schematically illustrates metal routes on pre-determined griddedrouting tracks formed using the steps illustrated in FIGS. 1A through1D;

FIG. 2A schematically illustrates an exemplary off-track mandrel metalroute;

FIGS. 2B through 2D schematically illustrate sequential steps of formingthe exemplary off-track mandrel metal route illustrated in FIG. 2A;

FIG. 3A schematically illustrates an exemplary off-track non-mandrelmetal route;

FIGS. 3B through 3D schematically illustrate sequential steps of formingthe off-track non-mandrel metal route illustrated in FIG. 3A;

FIG. 4A schematically illustrates an exemplary off-track mandrel metalroute in accordance with an exemplary embodiment;

FIGS. 4B through 4D schematically illustrate sequential steps of formingthe off-track mandrel metal route illustrated in FIG. 4A in accordancewith an exemplary embodiment;

FIG. 5A schematically illustrates an exemplary off-track non-mandrelmetal route in accordance with an exemplary embodiment; and

FIGS. 5B through 5D schematically illustrate sequential steps of formingthe off-track non-mandrel metal route illustrated in FIG. 5A inaccordance with an exemplary embodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of exemplary embodiments. It should be apparent, however,that exemplary embodiments may be practiced without these specificdetails or with an equivalent arrangement. In other instances,well-known structures and devices are shown in block diagram form inorder to avoid unnecessarily obscuring exemplary embodiments. Inaddition, unless otherwise indicated, all numbers expressing quantities,ratios, and numerical properties of ingredients, reaction conditions,and so forth used in the specification and claims are to be understoodas being modified in all instances by the term “about.”

The present disclosure addresses and solves the current problem oflayout inefficiency attendant upon devices utilizing off-track routingstructures. In accordance with embodiments of the present disclosure, amandrel is formed having a width of at least a distance between tracks.Additionally, or alternatively, a non-mandrel region is formed having awidth of at least a distance between tracks.

Methodology in accordance with embodiments of the present disclosureincludes: providing a hardmask on a substrate; providing a plurality offirst mandrels on the hardmask; providing a first spacer on each side ofeach of the first mandrels; providing a plurality of first non-mandrelregions of the substrate being separated from the first mandrels andbetween two of the first spacers, each of the first mandrels, firstnon-mandrel regions, and first spacers having a width equal to adistance; and providing a second mandrel having a width of at leasttwice the distance and being separated from one of the first non-mandrelregions by a second spacer and/or providing a second non-mandrel regionhaving a width of at least twice the distance and being adjacent to atleast one of the first spacers or a third spacer of a third mandrel andseparated from one or more block masks.

Still other aspects, features, and technical effects will be readilyapparent to those skilled in this art from the following detaileddescription, wherein preferred embodiments are shown and described,simply by way of illustration of the best mode contemplated. Thedisclosure is capable of other and different embodiments, and itsseveral details are capable of modifications in various obviousrespects. Accordingly, the drawings and description are to be regardedas illustrative in nature, and not as restrictive.

Adverting to FIG. 1A, a substrate 101 is provided with hardmask 103 andmandrels 105 being placed on mandrel tracks 107. Next, as illustrated inFIG. 1B, spacers 109 are formed on each side of each of the mandrels105. As shown, the spacers 109 separate mandrels 105 from non-mandrelregions 111 and the mandrels 105, spacers 109, and non-mandrel regions111 have equal widths. The mandrels 105 are removed in FIG. 1C,resulting in the spacers 109 separating mandrels tracks 107 fromnon-mandrel tracks 113. Additionally, a block mask 115 is placed in anon-mandrel track 113. Next, as shown in FIG. 1D, mandrel metal routes117 are formed in regions of the substrate 101 formerly covered bymandrels 105 and non-mandrel metal routes 119 are formed in non-mandrelregions 111. That is, mandrel metal routes 117 and non-mandrel metalroutes 119 are placed in recesses formed by etching exposed portions ofthe hardmask 103 and into the substrate 101 below those exposedportions. As shown, the spacers 109 and block mask 115 prevent etchingof other portions of the hardmask 103 and substrate 101.

FIG. 1E schematically illustrates metal routes on pre-determined griddedrouting tracks formed using the steps illustrated in FIGS. 1A through1D. As shown, mandrel metal routes 117 are formed on mandrel tracks 107and non-mandrel metal routes 119 are formed on non-mandrel tracks 113.Additionally, the block mask 115 has prevented a forming of anon-mandrel metal route 119 on one of the non-mandrel tracks 113. Blockmasks (e.g. 115) may also prevent a forming of mandrel metal routes(e.g., 117). Further, the mandrel and non-mandrel metal routes 117 and119, respectively, have equal widths and are separated by equaldistances. Such equal widths and distances may correspond to a criticaldistance associated with one or more masks for fabrication of an IC. Forexample, the mandrel and non-mandrel metal routes 117 and 119 may havewidths equal to a multiple of a critical distance associated with one ormore masks fabricating the IC. Additionally, each pair of mandrel metalroutes 117 is separated by at least one non-mandrel track 113 and eachpair of non-mandrel metal routes 119 is separated by at least onemandrel track 107. The metal routes (e.g., 117 and 119) may be within aM1 or M2 layer of an IC.

FIG. 2A schematically illustrates an exemplary off-track mandrel metalroute. As shown, mandrel tracks 201 and non-mandrel tracks 203 containmandrel metal route 205 and non-mandrel metal route 207, respectively,and an off-track mandrel metal route 209 is between one of the mandreltracks 201 and one of the non-mandrel tracks 203. As noted above,off-track routes (e.g., 209) may allow flexible pin access, redundantvia/via bar insertion, and metal transition, for instance, by, beingconnected to another (e.g., upper) metal layer via a redundant via, apin access, or a metal transition region.

FIGS. 2B through 2D schematically illustrate sequential steps of formingthe exemplary off-track mandrel metal route illustrated in FIG. 2A.Adverting to FIG. 2B, on-track mandrel 211 and off-track mandrel 213 areprovided with spacers 215 on each side. A positioning and width ofoff-track mandrel 213 results in a first region 217 and a second region219, each extending beyond non-mandrel tracks 203. First region 217 hasa width greater than a non-mandrel region. Therefore, a block mask wouldbe required to cover the remainder of first region 217 to preventunwanted subsequent etching of the hardmask and substrate thereunder.However, a block mask has a minimum width that exceeds the differencebetween the first region and a non-mandrel region. Therefore, a blockmask 221 must cover the entire first region 217, as shown in FIG. 2C.Similarly, no on-track mandrel (e.g., 211) can be provided within thesecond region 219, as the space between off-track mandrel 213 and anon-track mandrel 211 would not be large enough for a spacer to be formedfor each mandrel. However, since the difference between the secondregion 219 and a non-mandrel region is larger than a block mask minimumwidth, a block mask may be formed only in a portion of second region219, leaving an opening for non-mandrel region 225.

Adverting to FIG. 2D, the mandrels are removed, and mandrel metal route205 is formed in a recess formerly covered by mandrel 211, non-mandrelroute 207 is formed in non-mandrel region 225, and off-track mandrelmetal route 209 is formed in a region formerly covered by off-trackmandrel 213. Therefore, the positioning and width of off-track mandrel213 prevent a placement on two of the mandrel tracks 201 and on two ofthe non-mandrel tracks 203.

FIG. 3A schematically illustrates an exemplary off-track non-mandrelmetal route. As shown, mandrel tracks 301 and non-mandrel tracks 303contain mandrel metal route 305 and non-mandrel metal route 307,respectively, and an off-track non-mandrel metal route 309 is betweenone of the mandrel tracks 301 and one of the non-mandrel tracks 303.

FIGS. 3B through 3D schematically illustrate sequential steps of formingthe off-track non-mandrel metal route illustrated in FIG. 3A. Advertingto FIG. 3B, on-track mandrels 311 and 313 are provided with spacers 315on each side. A first non-mandrel region 317 is provided adjacent to oneof the spacers 315 of the mandrel 313. However, the positioning ofoff-track non-mandrel metal route 309 into non-mandrel region 319 formsa space between spacer 315 and non-mandrel region 319 which would needto be covered by a block mask. However, the space is smaller than ablock mask minimum width. Therefore, no mandrel metal route may beformed. As such, mandrel 313 and the spacer closest to region 319 areremoved, and block mask 325 is formed as shown in FIG. 3C. In addition,the space between non-mandrel region 319 and spacer 315 of mandrel 311precludes formation of an on-track non-mandrel metal route (e.g. 307)between off-track non-mandrel metal route 309 and mandrel metal route305. Therefore, a block mask 323 is formed, as shown in FIG. 3C.

Adverting to FIG. 3D, the mandrel is removed, and mandrel metal route305 is formed in a recess formerly covered by mandrel 311, non-mandrelroute 307 is formed in non-mandrel region 317, and off-track non-mandrelmetal route 309 is formed in non-mandrel region 319. However, thepositioning and width of off-track non-mandrel metal route 309 prevent aplacement on two of the mandrel tracks 301 and on two of the non-mandreltracks 303.

FIG. 4A schematically illustrates an exemplary off-track mandrel metalroute, in accordance with an exemplary embodiment. As shown, mandreltracks 401 and non-mandrel tracks 403 contain mandrel metal routes 405and non-mandrel metal routes 407, respectively, and an off-track mandrelmetal route 409 is positioned on one of the mandrel tracks 401 andextends onto at least a midpoint between the one of the mandrel tracks401 and one of the non-mandrel tracks 403. As shown, the off-trackmandrel metal route 409 has a width of twice of a width of each of themandrel metal routes 405 and the non-mandrel metal routes 407.

FIGS. 4B through 4D schematically illustrate sequential steps of formingthe off-track mandrel metal route illustrated in FIG. 4A, in accordancewith an exemplary embodiment. Adverting to FIG. 4B, on-track first andsecond mandrels 411 and 413, respectively, and off-track mandrel 415 areprovided with spacers 417 on each side. The off-track mandrel 415 ispositioned and sized such that a spacer 417 on one side of the mandrel415 abuts a boundary of a non-mandrel region 419 and a spacer 417 on theother side abuts a spacer 417 for the second mandrel 413. As such, noblock mask is needed to separate the off-track mandrel 415 from thenon-mandrel region 419. Furthermore, spacers 417 cover an entire uppersurface between the off-track mandrel 415 and on-track second mandrel413. As such, no block mask is required to cover a region betweenoff-track mandrel 415 and on-track second mandrel 413. As illustrated inFIG. 4C, mandrels 411, 413, and 415 are removed. Adverting to FIG. 4D,mandrel metal routes 405 are formed in recesses formerly covered bymandrels 411 and 413, non-mandrel routes 407 are formed in non-mandrelregions 419, and off-track mandrel metal route 409 is formed in a regionformerly covered by off-track mandrel 415. As such, the extending of awidth of the off-track mandrel 415 allows a positioning of spacers 417to prevent a forming of an unwanted space between spacers 417 andnon-mandrel regions 419. Thus, no block masks are necessary and theplacement of the off-track mandrel 415 only prevents a placement ofmetal routes on one of the mandrel tracks 401 and on one of thenon-mandrel tracks 403, thereby saving two tracks.

FIG. 5A schematically illustrates an exemplary off-track non-mandrelmetal route, in accordance with an exemplary embodiment. As shown,mandrel tracks 501 and non-mandrel tracks 503 contain mandrel metalroutes 505 and non-mandrel metal route 507, respectively, and anoff-track non-mandrel metal route 509 is positioned on one of thenon-mandrel tracks 503 and extends onto at least a midpoint between theone of the non-mandrel tracks 503 and one of the mandrel tracks 501. Asshown, the off-track non-mandrel metal route 509 has a width of twice ofa width of each of the mandrel metal routes 505 and the non-mandrelmetal routes 507.

FIGS. 5B through 5D schematically illustrate sequential steps of formingthe off-track non-mandrel metal route illustrated in FIG. 5A, inaccordance with an exemplary embodiment. Adverting to FIG. 5B, on-trackmandrels 511 are provided with spacers 513 on each side. As shown, aspacer 513 of one of the on-track mandrels 511 is adjacent to thenon-mandrel region 519. As such, no block mask is needed to preventetching of a portion between the non-mandrel region 519 and a spacer513. However, region 517 extends beyond the non-mandrel region 519. Assuch, a block mask 521 is provided in FIG. 5C, to form non-mandrelregion 519. Adverting to FIG. 5D, mandrel metal routes 505 are formed inrecesses formerly covered by mandrels 511, a non-mandrel route 507 isformed in non-mandrel region 515, and off-track non-mandrel metal route509 is formed in non-mandrel region 519. As such, the extending of awidth of the non-mandrel region 519 allows use of only a single blockmask (e.g., block mask 521). Thus, the placement and width of theoff-track non-mandrel route 509 only prevents a placement on one of themandrel tracks (e.g. 501) and on two of the non-mandrel tracks (e.g.503), thereby saving a track.

The embodiments of the present disclosure can achieve several technicaleffects including off-track metal structures preventing a placement onno more than three tracks, resulting in an improved layout efficiency ofa resulting design. The present disclosure enjoys industrialapplicability in any of various types of highly integrated semiconductordevices, particularly in IC devices utilizing SADP technology.

In the preceding description, the present disclosure is described withreference to specifically exemplary embodiments thereof. It will,however, be evident that various modifications and changes may be madethereto without departing from the broader spirit and scope of thepresent disclosure, as set forth in the claims. The specification anddrawings are, accordingly, to be regarded as illustrative and not asrestrictive. It is understood that the present disclosure is capable ofusing various other combinations and embodiments and is capable of anychanges or modifications within the scope of the inventive concept asexpressed herein.

What is claimed is:
 1. A device comprising: an integrated circuit (IC)formed on a substrate; a plurality of metal routes extendinghorizontally on the substrate and placed on one of a plurality ofequally spaced vertical positions being separated by a distance; and ametal route of the metal routes positioned on one of the verticalpositions and extending vertically onto at least a midpoint between theone vertical position and another vertical position.
 2. The deviceaccording to claim 1, further comprising: a second metal route of themetal routes being positioned on a second vertical position of thevertical positions adjacent to the one vertical position.
 3. The deviceaccording to claim 2, further comprising: a third metal route of themetal routes being positioned on a third vertical position of thevertical positions being within three vertical positions from the onevertical position, the second and third vertical positions being onopposite sides of the one vertical position.
 4. The device according toclaim 3, further comprising: the metal routes being formed by either amandrel metal or a non-mandrel metal of a self-aligned-double-patterning(SADP) technology, wherein metal routes formed by a mandrel metal areseparated from each other by at least one vertical position and metalroutes formed by a non-mandrel metal are separated from each other by atleast one vertical position.
 5. The device according to claim 4, furthercomprising: the third metal route of the metal routes being positionedon a vertical position three vertical positions from the one verticalposition when the one metal route is formed by a non-mandrel metal andpositioned on a vertical position two vertical positions from the onevertical position when the one metal route is formed by a mandrel metal.6. The device according to claim 1, further comprising: the metal routesbeing within a M1 or M2 layer of the IC.
 7. The device according toclaim 6, further comprising: the metal route being connected to anothermetal layer via a redundant via, a pin access, or a metal transitionregion.
 8. The device according to claim 1, wherein the distance is amultiple of a critical distance associated with one or more masksfabricating the IC.
 9. A device comprising: a hardmask on a substrate; aplurality of first mandrels on the hardmask; a first spacer on each sideof each of the first mandrels; a plurality of first non-mandrel regionsof the substrate being separated from the first mandrels and between twoof the first spacers, each of the first mandrels, first non-mandrelregions, and first spacers having a width equal to a distance; a secondmandrel having a width of at least twice the distance and having asecond spacer adjacent to one of the first non-mandrel regions and/orproviding a second non-mandrel region having a width of at least twicethe distance and being adjacent to at least one of the first spacers ora third spacer of a third mandrel and separated from one or more blockmasks; wherein the first mandrels are removed after providing the firstspacers; wherein the hardmask is etched and each respective spacer ofthe first spacers prevents etching of one or more portions covered bythe respective spacer; wherein the substrate is etched after etching ofthe hardmask, the hardmask preventing etching of portions covered by thehardmask; and a metal layer in recesses formed by the etching of thesubstrate.
 10. The device according to claim 9, further comprising: afourth mandrel having a width of at least the distance; and one or morespacers between the second and fourth mandrels, the one or more spacerscovering an entire upper surface of the hardmask between the second andthird mandrels and having a width of twice the distance.
 11. The deviceaccording to claim 10, wherein the one or more spacers comprise a fourthspacer adjacent to the second mandrel and a fifth spacer adjacent to thefourth mandrel.
 12. The method according to claim 9, wherein the secondnon-mandrel region is provided, the method further comprising: providingthe third spacer and the third mandrel having widths of at least thedistance; and providing one of the block masks between the secondnon-mandrel region and either the one first spacer or the third spacer,the one block mask having a width of three times the distance andpreventing an etching of portions of the hardmask covered by the oneblock mask.
 13. A device comprising: a hardmask on a substrate; aplurality of first mandrels on the hardmask; a first spacer on each sideof each of the first mandrels; a plurality of first non-mandrel regionsof the substrate being separated from the first mandrels and between twoof the first spacers, each of the first mandrels, first non-mandrelregions, and first spacers having a width equal to a distance; and asecond mandrel having a width of at least twice the distance and beingseparated from one of the first non-mandrel regions by a second spacerand/or providing a second non-mandrel region having a width of at leasttwice the distance and being adjacent to at least one of the firstspacers or a third spacer of a third mandrel and separated from one ormore block masks.
 14. The device according to claim 13, furthercomprising: a fourth mandrel on the hardmask; and one or more spacersbetween the second and fourth mandrels, the one or more spacers coveringan entire upper surface of the hardmask between the second and fourthmandrels.
 15. The device according to claim 14, wherein the fourthmandrel has a width of at least the distance, and the one or morespacers has a width of twice the distance.
 16. The device according toclaim 15, wherein the one or more spacers comprise a fourth spaceradjacent to the second mandrel and a fifth spacer adjacent to the fourthmandrel, each of the fourth and fifth spacers having a width equal tothe distance.
 17. The device according to claim 13, further comprising:one of the block masks between the second non-mandrel region and one ofthe first or third spacers, the block mask preventing etching ofportions of the hardmask covered by the one block mask.
 18. The deviceaccording to claim 17, wherein the third mandrel region has a width ofat least the distance and the third spacer has a width of the distance;and the one block mask has a width of at least three times the distance.19. The method according to claim 13, wherein the hardmask is etched,and each respective spacer of the first spacers prevents etching of oneor more portions covered by the respective spacer; the substrate isetched after etching of the hardmask, the hardmask preventing etching ofportions covered by the hardmask; and a metal layer formed in recessesformed by the etching of the substrate.
 20. The device according toclaim 19, wherein the first mandrels are removed prior to etching thehardmask; and a mandrel metal route provided in a recess formed byetching a portion of the hardmask formerly covered by one of the firstmandrels and a non-metal route is formed in a recess formed by etchingthe hardmask in one of the first non-mandrel regions.